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The importance of nanoelectronics for the future is well-recognized. Next-generation nanoelectronic technologies, for the usage in intelligent implants, intelligent drugs or even ICs for the coupling of destroyed nerves, are sensitive to dimensional change. Therefore, an appropriate packaging is essential to the success or failure of these technologies. In this paper current work to use DNA as a template for bonding at the nanoscale and for novel nanoelectronic components is presented. Moreover, a method is presented, which enables the handling and manipulation of DNA at dry conditions, thus enabling the feasible usage for industrial purposes as well as for science. For this the necessary steps, starting with the immobilization and choice of useable nanowires, followed by the extraction and separation of these wires, the coarse positioning, the immobilization onto the target substrates as well as a proper fine tuning at the target are presented.
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